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Patent Searching and Data


Title:
RESIN MOLDED BODY AND RESIN LAMINATE
Document Type and Number:
Japanese Patent JP2014105284
Kind Code:
A
Abstract:

To provide a resin molded body and a resin laminate maintaining high antistatic ability for a long period and suitable for a floor material and the like.

A resin molded body is manufactured by extrusion molding a resin composition containing (A) a thermoplastic resin such as ABS resin or ASA resin, (B) a wood flour and (C) a polymer antistatic agent and has the blend ratio of (A) the thermoplastic resin and (B) the wood flour in the resin composition of (A) 50 to 95 mass% and (B) of 5 to 50 mass%, the blend amount of (C) the polymer antistatic agent of 3 to 20 pts.mass based on 100 pts.mass of total amount of (A) the thermoplastic resin and (B) the wood flour, and the moisture content in the resin molded body of 2 to 10 mass%.


Inventors:
MIZUNO YOSHITAKA
Application Number:
JP2012259437A
Publication Date:
June 09, 2014
Filing Date:
November 28, 2012
Export Citation:
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Assignee:
FUKUVI CHEM IND CO
International Classes:
C08L51/00; B29C47/00; B29C47/06; B32B27/18; C08L97/00; C08L101/12
Domestic Patent References:
JP2008019355A2008-01-31
JP2005097598A2005-04-14
JP2004250942A2004-09-09
JP2003251724A2003-09-09
JP2003049530A2003-02-21
JP2000326382A2000-11-28
JP2013204252A2013-10-07
JPH0812963A1996-01-16
JP2004156277A2004-06-03
JPS5472247A1979-06-09
Other References:
野田英利: "活躍する三洋化成グループのパフォーマンス・ケミカルス88 低抵抗型永久帯電防止剤", 三洋化成ニュース, JPN6016009009, 2010, JP, ISSN: 0003273184
Attorney, Agent or Firm:
Naozumi Ono
Sachiko Okunuki