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Patent Searching and Data


Title:
RESIN MULTILAYER DEVICE AND FLIP CHIP MOUNTING DEVICE
Document Type and Number:
Japanese Patent JP2010154516
Kind Code:
A
Abstract:

To provide a resin multilayer device capable of achieving accurate impedance and low insertion loss, and having a balun having a simple and compact structure.

The resin multilayer device includes: a substrate 10; balanced signal transmission paths 30, 35 formed on a first resin layer 22; an unbalanced signal transmission path 50 formed on a second resin layer 24 by being faced to the balanced signal transmission paths; ground terminals 70, 75, output/input terminals 60, 65 and an input/output terminal 90 respectively formed in openings of a third resin layer 26 on the second resin layer; wherein the balanced signal transmission paths are each arranged in a planar spiral shape having a space in the inner periphery; the unbalanced signal transmission path includes a first space E1 in the inner periphery of a planer spiral part 50c facing the balanced signal transmission path 30, and a second space E2 in the inner periphery of a planar spiral part 50d facing the balanced signal transmission path 35; the ground terminal 70 is arranged in the space E1; and the ground terminal 75 and the input/output terminal 90 are arranged in the space E2.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
UEMICHI YUSUKE
AIZAWA TAKUYA
NAKAO SATORU
Application Number:
JP2009263948A
Publication Date:
July 08, 2010
Filing Date:
November 19, 2009
Export Citation:
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Assignee:
FUJIKURA LTD
International Classes:
H01P5/10; H01F19/06
Attorney, Agent or Firm:
Masatake Shiga
Tadashi Takahashi
Takashi Watanabe