To obtain a resin paste composition that can lower the warpage deformation of a packages in a tape carrier type BGA to increase the splicing reliability of a mother boat, reduces the occurrence of reflow cracks on solder reflow to increase the reflow resistance reliability, and provide a semiconductor device of high productivity and high reliability using the same.

A methacrylic ester represented by formula (I) (wherein R1 is H or methyl; (n) and (m) are independently from each other an integer of 0-6), a radical initiator and fillers are uniformly dispersed to prepare the objective paste composition. In addition, the composition is used to allow a semiconductor element to bond to a substrate and they are sealed to give the semiconductor device.