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Title:
RETICLE AND WAFER
Document Type and Number:
Japanese Patent JPS61131439
Kind Code:
A
Abstract:
PURPOSE:To enable to obtain an extremely high matching precision by a method wherein the title device is provided with the sircuit pattern of a reticle and a group of first and second masks for off-axis alignment, which are different in size. CONSTITUTION:This alignment device is a reticle and wafer alignment device provided with the circuit pattern of a reticle and a group of first and second masks for off-axis alignemnt, which are different in size. That is, the light- shielding unit BL is dispsoed in such a way that its surface to light-shield has a conjugate relation with the circuit pattern surface CP of the reticle RT by lens systems L4, L5 and L6, the reticle RT is replaced to a reticle, which is different in the thickness of its transparent part such as glass, and when the refracting power is made to vary, the light-shielding unit BL can be made to shift to the optical axis direction for maintaining the above-mentioned conjugate relation. Moreover, a substrate SL is fixed on a reduction lens PO, part of the lens PO is made to protrude to the upper direction and reticle reference marks RKR and RKL are provided on the upper surface. The set marks RSR and RSL of the reticle are made to conform to the reticle reference masks RKR and RKL and the reticle alignment is performed.

Inventors:
AYADA NAOKI
YAMAMURA MITSUGI
HAMAZAKI FUMIYOSHI
KOSUGI MASAO
TAKAHASHI KAZUO
SEKI MITSUAKI
Application Number:
JP25192484A
Publication Date:
June 19, 1986
Filing Date:
November 30, 1984
Export Citation:
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Assignee:
CANON KK
International Classes:
H01L21/30; G03F7/20; G03F9/00; H01L21/027; (IPC1-7): G03F9/00
Attorney, Agent or Firm:
Tatsuo Ito



 
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