To provide a semi-conductor integrated circuit device capable of integrating an electronic circuit with a MEMS (Micro Electro Mechanical System) by using a general semi-conductor manufacturing technology.
The semi-conductor integrated circuit device includes an electronic circuit provided in a semi-conductor substrate, and a MEMS provided in other area than the area with the electronic circuit being provided therein and including at least a piezoelectric body. A large number of interlayer insulating films, via holes formed in a predetermined area of the interlayer insulating films, and first, second, third and fourth metal plugs formed in the via holes are provided in an upper part of the electronic circuit. A deposited film having the thickness substantially same as the thickness of a large number of interlayer insulating films is provided in an upper part of the MEMS, and the deposited film forms a part of a structure of the MEMS.
TAKAOKA MASAKI
FUJIMORI TAKAKAZU
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