Title:
SEMICONDUCTOR-CHIP MOUNTING METHOD AND SUBSTRATE STRUCTURE
Document Type and Number:
Japanese Patent JPH06168980
Kind Code:
A
Abstract:
PURPOSE: To provide a flip-chip type high density semiconductor chip loading method, having improved manufacturing processes, and its substrate structure. CONSTITUTION: This method consists of a step for fitting a chip 6 and a substrate 11 by arraying a pad P of the chip 6, the through-hole of a film and the through-hole of the substrate 11, so as to match each other in a state which holds a film-type insulating adhesive layer 8, forming a through-hole on a position corresponding to the chip pad P between the chip 6 and the substrate 11, a means for mutually connecting the pad P of the chip 6 with a conductive wiring network 10, formed in the substrate 11 by forming a conductive layer 12, so as to continuously apply the metallic pad P of the chip which blocks one side of the through-hole from the rear face opposite the upper surface of the substrate 11 on which the chip 6 is fitted, the inwall of the through-hole and the rear face of the substrate and a step for filling the inside of a conductive recessed part formed by the applied conductive layer 12 with an insulating substance.
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Inventors:
KIN KIYUUSEI
Application Number:
JP18008893A
Publication Date:
June 14, 1994
Filing Date:
July 21, 1993
Export Citation:
Assignee:
SAMSUNG ELECTRONIC
International Classes:
H01L21/56; H01L21/48; H01L21/60; H01L23/498; H05K3/32; (IPC1-7): H01L21/60
Attorney, Agent or Firm:
Fukami Hisaro (3 outside)