Title:
SEMICONDUCTOR DEVICE AND HEAT SINK THEREOF
Document Type and Number:
Japanese Patent JP3451979
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a low thermal expansion, high thermal conductivity heat sink excellent in deformation processing by bonding a semiconductor element directly to a heat sink where a flat part for mounting the semiconductor element is formed integrally with a fin part provided on the opposite side.
SOLUTION: A semiconductor element 101 is bonded directly, on the rear side thereof, to a heat sink 106 through a bonding material 105, e.g. solder. The heat sink 106 is provided with fins 107 for ensuring heat dissipation being integrated with a flat part 108 being boded to the semiconductor element 101. Since the heat sink 106 is integrated, a part having significantly low thermal conductivity is not required and heat dissipation of the heat sink is enhanced resulting in effective cooling of the semiconductor element. Consequently, a low thermal expansion, high thermal conductivity heat sink for a semiconductor device excellent in deformation processing, and a semiconductor device employing that heat sink, can be obtained.
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Inventors:
Ryuichi Saito
Yasuo Kondo
Yoshihiko Koike
Yasuo Kondo
Yoshihiko Koike
Application Number:
JP12128299A
Publication Date:
September 29, 2003
Filing Date:
April 28, 1999
Export Citation:
Assignee:
株式会社日立製作所
International Classes:
H01L23/34; H01L23/373; H01L23/40; (IPC1-7): H01L23/373
Domestic Patent References:
| JP6224334A | ||||
| JP6412404A | ||||
| JP62160540U |
Other References:
【文献】国際公開00/34539(WO,A1)
Attorney, Agent or Firm:
Yasuo Sakuta
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