To restrain dispersion of cutting chips and residue of the cutting chips with a simple constitution.

A semiconductor device manufacturing method includes steps of: cutting a tip part 202 by shearing with a die 20 and a punch 50 while the tip part 202 of an external lead (lead 201) of a semiconductor device 200 is held by the die 20 and a presser member 40; and isolating the die 20 from the presser member 40. An elastic body (for example, plate-like elastic body 80) projecting from face of the presser member 40 on the die 20 side toward the die 20 is provided on the presser member 40. When the external lead is held by the die 20 and the presser member 40, the elastic body is pressed by the die 20 and is elastically deformed to a side opposite to the die 20. The die 20 is isolated from the presser member 40, and therefore, the elastic body is elastically returned toward the die 20. The tip part 202 that become a cutting chip 203 by cutting is removed from the presser member 40 and the die 20 by the elastic body.