SEMICONDUCTOR DEVICE, MOUNTING THEREOF AND MOUNTING STRUCTURE

Title:

SEMICONDUCTOR DEVICE, MOUNTING THEREOF AND MOUNTING STRUCTURE

Document Type and Number:

Japanese Patent JPH09306954

Kind Code:

A

Abstract:

To obtain a technique to improve the heat radiation efficiency of a semiconductor device having a package structure, on which a semiconductor chip is mounted on one surface of a wiring board through bump electrodes and resin is charged in the gaps between one surface of the board and the principal plane of the chip.

A semiconductor device having a package structure, on which a semiconductor chip 3 is mounted on one surface of a wiring board 2 through bump electrodes 4 and resin 5 is charged in the gaps between one surface of the board 2 and the principal plane of the chip 3, comprises an aluminium nitride-made flat plate 7 on the opposite back plane of the chip 3 to its principal plane. This plate 7 has a plane size larger than that of the chip 3 and has a fixing region of its one surface which is fixed through a braze 6 to the back plane of the chip 3.

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Inventors:

ANDO HIDEKO
KIKUCHI HIROSHI
SATO TOSHIHIKO
HAYASHIDA TETSUYA

Application Number:

JP12415696A

Publication Date:

November 28, 1997

Filing Date:

May 20, 1996

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

H01L21/56; H01L21/60; H01L23/12; H01L23/36; H01L23/373; H01L23/433; H05K3/34; H05K3/30; (IPC1-7): H01L21/60; H01L23/12; H01L23/36

Attorney, Agent or Firm:

秋田収喜

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