Title:
SEMICONDUCTOR DEVICE PACKAGE
Document Type and Number:
Japanese Patent JP2013243394
Kind Code:
A
Abstract:
To provide a semiconductor device resin package in which reliability of bonding surfaces among lead frames and resins is improved.
By forming surfaces of lead frames 2 into mesh structures, bonding areas among the lead frames 2 and resins can be increased. Further, on account of this, only fillers having small particle diameters are taken in the vicinities of the lead frames 2, influence of stress can be reduced, deformation of the lead frames 2 is suppressed, detachment of integral bonding surfaces among the lead frames 2 and a resin package main body 4 hardly occurs and an intrusion of moisture and contaminants and various types of adverse effects associated with the intrusion thereof can be prevented.
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| JP2009054634 | SEMICONDUCTOR DEVICE |
Inventors:
KADOI MASAAKI
Application Number:
JP2013154937A
Publication Date:
December 05, 2013
Filing Date:
July 25, 2013
Export Citation:
Assignee:
SEIKO INSTR INC
International Classes:
H01L23/50; H01L23/28
Domestic Patent References:
| JPH02285662A | 1990-11-22 |
Attorney, Agent or Firm:
Kentaro Kuhara
Noriaki Uchino
Nobuyuki Kimura
Noriaki Uchino
Nobuyuki Kimura
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