Title:
半導体装置
Document Type and Number:
Japanese Patent JP4397210
Kind Code:
B2
Abstract:
A semiconductor device including a multiplicity of large current power elements with each power element divided into a multiplicity of divisional elements and arranged such that the power elements belonging to different power elements are arranged in a repetitive sequential order. The IC chip of the semiconductor device is formed to have output wires extending from the respective divisional elements connected to corresponding output pads without crossing other output wires. Arranged on the IC chip are output bumps in association with the respective output pads. A rewiring layer is provided having output coupling wires for connecting together the bumps that belong to the same power element and connecting them further to an external output electrode.
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Inventors:
Kunihiro Komiya
Application Number:
JP2003358599A
Publication Date:
January 13, 2010
Filing Date:
October 20, 2003
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
H01L21/822; H01L21/82; H01L23/538; H01L25/04; H01L25/07; H01L27/04
Domestic Patent References:
| JP11168178A | ||||
| JP2126672A |
Attorney, Agent or Firm:
Shizuo Sano
Hideki Hayashida
Hideki Hayashida