To suppress height variations among connector terminals on the surface of a package substrate and stresses in the terminals, by forming an adhesive for fixing the package substrate to a heat sink in such a state that the stress caused by the thermal expansion of the heat sink does not warp the package substrate.
A package substrate 4 having the same size as a heat sink 2 has is stuck to the upper surface of the plate 2 with an adhesive 6. The adhesive 6 is composed of silicon rubber or an epoxy resin and the adhesive 6 interposed between the plate 2 and the substrate 4 is formed relatively thick. The adhesive 6 is formed so that the stress applied to the substrate 4 by the thermal expansion of the plate 2 can be relieved as much as possible to prevent the warping of the substrate 4 by the stress. Therefore, the occurrence of height variations among connector terminals 12 on the surface of the substrate 4 and stresses in the terminals 12 can be suppressed.
MATSUGAMI SHOJI
OZAKI HIROSHI
TSUBOI TOSHIHIRO
SHIRAI MASAYUKI
MATSUNAGA TOSHIHIRO
TSUTSUMI YASUKI
HITACHI MICROCOMPUTER SYST
| JPS5048018A | 1975-04-28 |
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