Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS5429589
Kind Code:
A
Abstract:
PURPOSE:To prevent the uppermost wiring layer from being scaled at the throughhole part and its vicinity and to avoid defective wiring, by taking constitution that the uppermost metal of wiring of the metal layer construction is not made at the through-hole part or its neighbour, in a semiconductor device of multilayer construction.
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Inventors:
NAKAMURA MASARU
Application Number:
JP9593577A
Publication Date:
March 05, 1979
Filing Date:
August 09, 1977
Export Citation:
Assignee:
NIPPON ELECTRIC CO
International Classes:
H01L23/522; H01L21/768; (IPC1-7): H01L21/88