PURPOSE: To obtain a semiconductor exposure device which is capable of executing accurate alignment by a method wherein a reticule is provided with the patterns of chips for exposure, and a pattern for each chip is equipped with an alignment mark.

CONSTITUTION: Alignment marks a and b for chips 1 to 8 on a wafer 41 are arranged at different points to a center of each shot respectively. That is, in a shot, B-I of column B and row I, the alignment marks a and b of a chip 1 are arranged on a left lower side of a center, and in a shot A-II, the alignment marks a and b of a chip 2 are arranged on a right upper side of a center. The alignment marks a and b of chips 1 to 8 are measured as sample shots, and alignment marks a and b in a shot are capable of being selected for each chip. By this setup, a semiconductor light exposure device is capable of being enhanced in alignment accuracy.