To reduce manufacturing cost, to rationalize a manufacturing process, and to allow soldering containing no lead.
A pressure-sensitive element 4' constituted by forming a diaphragm 1, a strain gauge 2 and an electrode part 3 on a semiconductor substrate 4 is jointed to a stem 9 of an insulation substrate. A through-hole 6 with a conductive film 5 formed in a wall face of the hole 6 is arranged in the stem 9, and a conductive material 7 fusion-solidified to seal the through-hole 6 is introduced in the through-hole 6. One portion of the fusion-solidified conductive material 7 is spread up to an electrode 3 surface of the pressure-sensitive element 4', and the electrode part 3 of the element 4' is jointed to the conductive film 5 of the through-hole 6 via the conductive material 7.
MIKI MASAYUKI
ICHIKAWA NORIO
KUBOTA MASANORI
HITACHI CAR ENG CO LTD
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