PURPOSE: To obtain the titled device of good heat dissipating effect by a method wherein, when the bottom back of a disk with a semiconductor chip contained is soldered to the embossed part provided in a heat dissipating electrode fin, these are coupled with metal by interposal of a metallic plate which can be brazed therebetween.

CONSTITUTION: The embossed part 12 is formed in the heat dissipating electrode fin 11 made of a light metal such as Al, where the disk 17 with the semiconductor chip 15 contained is fixed with solder 22. The chip 15 is fixed in this disk 17 with the solder 16, a lead 18 being connected thereon via solder 19, and the disk 17 being then filled with silicon rubber 20 while the end of the lead 18 is exposed. In this construction, the metallic plate 21 is interposed between the embossed part 12 and the bottom back of the disk 17, where ultrasonic oscillation or high frequency oscillation is applied, then purely metallic surfaces are exposed to each other by the powder-dispersion of an oxide film produced at the junction surface therebetween. Thereafter, the surface of this plate 21 is bonded to the back of the disk 17 with solder 22.