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Title:
緩衝部を備えたセンサ
Document Type and Number:
Japanese Patent JP5611369
Kind Code:
B2
Abstract:
A sensor device, having a flexible printed circuit board that has a fastening section for a chip structure, a chip structure situated on the fastening section of the flexible printed-circuit board, and a damper element for damping the chip structure from mechanical influences. The fastening section of the flexible printed circuit board, the chip structure and the damper element are situated one on top of the other.

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Inventors:
トリスタン ジョベール
ウーヴェ ハンゼン
Application Number:
JP2012549309A
Publication Date:
October 22, 2014
Filing Date:
January 14, 2011
Export Citation:
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Assignee:
ローベルト ボツシユ ゲゼルシヤフト ミツト ベシユレンクテル ハフツングＲＯＢＥＲＴ ＢＯＳＣＨ ＧＭＢＨ
International Classes:
G01P15/08; G01C19/5783; G01P1/02
Attorney, Agent or Firm:
アインゼル Felix-Reinhardt
Takuya Kuno



 
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