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Title:
構造モニタリング用のセンサおよびセンサアレイ
Document Type and Number:
Japanese Patent JP2007505309
Kind Code:
A
Abstract:
A sensor for monitoring a structure, said sensor comprising a network of interconnected electrical pathways, wherein an electrical property of the pathways (preferably at least one of the impedance, the capacitance, the inductance and the resistance) is arranged in use to be responsive to a change in a predetermined physical property of the structure. The sensor network may comprises a first sub-network of pathways and a second sub-network of pathways, the first and second sub-networks being superposed. A method of monitoring the structural health of a structure having the aforementioned sensor comprising the steps of monitoring an electrical property of the sensor, measuring changes in the monitored electrical property in order to identify and locate a structural event across the sensor, assessing the level of damage by comparing the measured change in the electrical property with that for known strain events, and sending an alert in the event the damage is assessed as significant.

Inventors:
Williamson, Caroline
Lumber, Humberstone
Clark, Andrew Bryson
Application Number:
JP2006525879A
Publication Date:
March 08, 2007
Filing Date:
September 07, 2004
Export Citation:
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Assignee:
Kinetic Limited
International Classes:
G01B7/16; G01L1/20; G01L1/22; G01M5/00; G01M99/00; G01N27/02; G01N27/20
Domestic Patent References:
JPS59121533A1984-07-13
JPS60245240A1985-12-05
JPS61105633A1986-05-23
JPS63148812U1988-09-30
JPH0333244A1991-02-13
JPH09273906A1997-10-21
JPH11202211A1999-07-30
JP2000146746A2000-05-26
JP2002503818A2002-02-05
JPH11302936A1999-11-02
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Chihiro Watanabe
Kenkyo Kanayama
Katsuma Osaki
Mitsuaki Tsubokura