Title:
破砕防止超薄ガラス及びその取り扱い
Document Type and Number:
Japanese Patent JP2005538536
Kind Code:
A
Abstract:
The invention relates to a concept for handling and processing thin glass and ultra-thin glass (glass having a thickness that does not significantly exceed 200 nm) by means of a detachable joining to a stable support, whereby existing superstructures for conventional glass can continue to be utilized. Thin glass is an interesting substrate material that enables the realization of thin, light and even flexible applications.
Inventors:
Deborah Henseler
Karsten Heuser
Georg Wittmann
Ralph Petzold
Karsten Heuser
Georg Wittmann
Ralph Petzold
Application Number:
JP2004522131A
Publication Date:
December 15, 2005
Filing Date:
July 17, 2003
Export Citation:
Assignee:
Osram Opto Semiconductors GmbH
International Classes:
H01L21/673; B32B7/06; B32B7/12; B32B17/06; B65G49/06; C03B35/14; C03C17/00; C03C17/06; C03C17/32; C03C17/38; C03C27/10; H05K3/00; H05K1/03; (IPC1-7): H01L21/68
Domestic Patent References:
| JP2001520951A | 2001-11-06 | |||
| JP2001520950A | 2001-11-06 | |||
| JP2000239046A | 2000-09-05 | |||
| JPH10261701A | 1998-09-29 |
Foreign References:
| US6309901B1 | 2001-10-30 | |||
| US5073181A | 1991-12-17 |
Attorney, Agent or Firm:
Toshio Yano
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel
Toshiomi Yamazaki
Takuya Kuno
Einzel Felix-Reinhard
Reinhard Einsel