Title:
SIGNAL TRANSPORT SUBSTRATE AND CONNECTION STRUCTURE OF SIGNAL TRANSPORT SUBSTRATE AND CONNECTOR
Document Type and Number:
Japanese Patent JP2005244029
Kind Code:
A
Abstract:
To provide a signal transport substrate that is electromagnetically shielded to obtain a much higher degree of freedom when designing a trace pattern or trace width of a signal line and to obtain a much higher degree of freedom also when adjusting a characteristic impedance.
A signal line 20 is provided along a lengthwise direction on one surface of a flat band-like flexible insulating substrate 30, net conductors 50, 60 are laminated for electromagnetically shielding the signal line 20 on both sides of the flexible insulating substrate 30, and meshes 56, 66 of the net conductors 50, 60 are formed at random to comprise a flat flexible cable 10 that is a signal transport substrate.
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Inventors:
NODA ATSUTO
SUZUKI TERUHITO
NIITSU TOSHIHIRO
SUZUKI TERUHITO
NIITSU TOSHIHIRO
Application Number:
JP2004053558A
Publication Date:
September 08, 2005
Filing Date:
February 27, 2004
Export Citation:
Assignee:
MOLEX INC
International Classes:
H01B7/08; H01P3/08; H05K1/02; H05K1/11; H05K1/00; (IPC1-7): H05K1/02; H01B7/08; H01R12/22; H05K1/11
Attorney, Agent or Firm:
Hiroshi Ikeda