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Title:
シリコーン感圧接着剤組成物並びにその調製方法及びその使用
Document Type and Number:
Japanese Patent JP7334279
Kind Code:
B2
Abstract:
A silicone pressure sensitive adhesive composition is curable to form a silicone pressure sensitive adhesive. The silicone pressure sensitive adhesive composition can be coated on a substrate and cured to form a protective film. The protective film can be adhered to an anti-fingerprint coating on display glass, such as cover glass for a smartphone.

Inventors:
Chan, Chin Kui
Liu, Qi Hua
huang, fumin
Chen, Wenge
Choo, Chonglong
Chu, Cheerin
Application Number:
JP2021577535A
Publication Date:
August 28, 2023
Filing Date:
July 03, 2019
Export Citation:
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Assignee:
Dow Silicones Corporation
International Classes:
C09J183/07; C09J7/38; C09J11/06; C09J183/05
Domestic Patent References:
JP2013139515A
JP1033176A
JP2015512974A
JP2001081436A
JP51127132A
JP7197008A
JP2017537177A
Foreign References:
WO2018190047A1
Attorney, Agent or Firm:
Yasuhiko Murayama
Shinya Mihiro
Tatsuhiko Abe