SOCKET FOR IC - SONY CORP

Title:

SOCKET FOR IC

Document Type and Number:

Japanese Patent JPH11297439

Kind Code:

A

Abstract:

To reduce crosstalks between plural coil-shaped contacts which are used as connection conductors.

On one surface side of a printed wiring board 21, having contact electrodes 22 arranged and formed on one surface at the same pitch with an arrangement pitch of IC bumps, and terminal electrodes 23 respectively connected to the contact electrodes 22 formed on the other surface at an enlarged pitch, a base 41, is disposed. Through-holes 31 having magnetic film 47 on inner circumferential surfaces are provided in a bottom surface of a recessed part 29 in the base 41 to face the contact electrodes 22, and coil-shaped contacts 33 are disposed in the through-holes 31, so contact parts to the IC bumps are constituted. Each coil-shaped contact 33 is shielded by a magnetic film 47.

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Inventors:

IZAWA HISATAKA
MARU TSUNEO
SUZUKI KENZO
HIROIKE TOSHIMASA

Application Number:

JP9634198A

Publication Date:

October 29, 1999

Filing Date:

April 08, 1998

Export Citation:

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Assignee:

SONY CORP
TOKYO COSMOS ELECTRIC

International Classes:

H01R13/24; H01L23/32; H01R33/76; (IPC1-7): H01R33/76; H01L23/32; H01R13/24; H01R23/68

Attorney, Agent or Firm:

Kusano Taku (1 person outside)

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