To provide a soldering device allowing temperature control of solder, detecting the residual amount of solder, and allowing soldering of a large area.
This soldering device 100 includes, inside a soldering device body 1 having an opened upper part: a solder storage part 2 including a sealing space; a nozzle 4 penetrating a ceiling wall 20 of the solder storage part 2 and projecting on the opening side of the soldering device body 1; a gas injection port 6 introducing a compressed gas into the solder storage part 2; and a solder collection part 3 including a check valve 5 in a communication port 31 to the solder storage part 2 formed in a bottom part 30, and collecting the solder 9 flowing from the nozzle 4 and flowing on the inclined ceiling wall 20. Current carrying to a plurality of heaters 7 horizontally wound around side walls 11, 12 of the soldering device body 1 at different heights is independently controlled to control a solder temperature, and an electrode 57 provided in a valve shaft 51 of the check valve 5 is exposed from the solder 9 to detect the residual amount of the solder.
| JP2008213033A | 2008-09-18 | |||
| JPH0394975A | 1991-04-19 | |||
| JP2006116601A | 2006-05-11 |
| WO2010098239A1 | 2010-09-02 |
Jun Tsuruta
Koichi Itsubo
Tomohiro Minamiyama
Kenichi Nakamura
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