Title:
SOLDERING DEVICE AND SOLDERING METHOD
Document Type and Number:
Japanese Patent JP2023093040
Kind Code:
A
Abstract:
To provide a soldering device and a soldering method that can respond to a variety of soldering targets and can improve productivity.SOLUTION: A soldering device 1 includes a head part 3, which is an upper unit for supplying solder, a thread solder cutting mechanism part 40 (described below), which is a cut unit for cutting a thread solder 2, which is solder, to make a solder piece 2b below the head unit, a nozzle 60 located on the lower portion of the thread solder cutting mechanism part 40, and a heater 51 that heats the nozzle 60. The nozzle 60 is provided with a first solder piece supply passage 61a that extends to a predetermined lower end position and a second solder piece supply passage 61b whose lower end position is different from that of the first solder piece supply passage 61a. The nozzle 60 has a first passage forming part 63a that forms the first solder piece supply passage 61a and a second passage forming part 63b that forms the second solder piece supply passage 61b.SELECTED DRAWING: Figure 9
More Like This:
| JP4241979 | Soldering method and soldering equipment |
| JPH02292889 | WIRING BOARD FOR LARGE CURRENT |
Inventors:
ATARU SHINICHIRO
MATSUYAMA MITSUKI
ISHIGAKI SEIYA
MARUYAMA KEISUKE
MATSUYAMA MITSUKI
ISHIGAKI SEIYA
MARUYAMA KEISUKE
Application Number:
JP2021208434A
Publication Date:
July 04, 2023
Filing Date:
December 22, 2021
Export Citation:
Assignee:
PARAT CO LTD
DENSO CORP
DENSO CORP
International Classes:
H05K3/34; B23K3/02; B23K3/06
Attorney, Agent or Firm:
Hironori Nishihara
Ryohito Noro
Ryohito Noro