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Title:
固体撮像装置、その製造方法およびカメラ
Document Type and Number:
Japanese Patent JP6393070
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a technique that is advantageous in layout design of plural wires on an imaging area in a solid-state image pickup device having an imaging area which is supplied with a power supply voltage.SOLUTION: A solid-state image pickup device has plural photoelectric converters arranged on a semiconductor substrate, an impurity area which is formed between two adjacent photoelectric converters out of the plural photoelectric converters and applies potential to the semiconductor substrate, two or more wires containing a power supply wire which are arranged on the semiconductor substrate so as to pass through the gap between the two photoelectric converters along a first direction in plan view with respect to the upper surface of the semiconductor substrate, and a conductive member which is electrically connected to each of the impurity area and the power supply wire. In a cross-section passing through the impurity area and extending along a second direction intersecting to the first direction, the center of the power supply wire is displaced from the center of the impurity area to one side of the two photoelectric converters, and the conductive member contains a portion disposed along the second direction from an upper position of the impurity area to a lower position of the power supply wire.

Inventors:
Iwata Shunshi
Application Number:
JP2014088557A
Publication Date:
September 19, 2018
Filing Date:
April 22, 2014
Export Citation:
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Assignee:
Canon Inc
International Classes:
H01L27/146; H04N5/369
Domestic Patent References:
JP2009206260A
JP2004179469A
JP2013084740A
JP2010212288A
JP2012199301A
JP2001284629A
JP2013168634A
JP2013149740A
JP2001230400A
JP2006073736A
JP2010273095A
JP2007201269A
Foreign References:
WO2012144196A1
Attorney, Agent or Firm:
Yasunori Otsuka
Shiro Takayanagi
Yasuhiro Otsuka
Shuji Kimura
Osamu Shimoyama
Nagakawa Yukimitsu