Title:
SPUTTERING TARGET
Document Type and Number:
Japanese Patent JP2015183243
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a sintered-body sputtering target capable of producing inexpensively a layered sputtering target having each different composition area in the thickness direction of the target, having little fluctuation of the composition in each film, and capable of reducing generation of abnormal discharge (arcing) during sputtering to suppress generation of particles.SOLUTION: A sputtering target has two or more kinds of different composition areas by bonding target materials having two or more kinds of different composition ratios in the thickness direction.
Inventors:
ASANO TAKAYUKI
Application Number:
JP2014061438A
Publication Date:
October 22, 2015
Filing Date:
March 25, 2014
Export Citation:
Assignee:
JX NIPPON MINING & METALS CORP
International Classes:
C23C14/34; C22C5/04; C22C5/06; C22C14/00; C22C16/00; C22C19/03; C22C19/05; C22C19/07; C22C21/00; C22C21/06; C22C23/00; C22C23/02; C22C27/00; C22C27/02; C22C27/04; C22C27/06; C22C38/00; H01L21/285
Domestic Patent References:
| JPH06136522A | 1994-05-17 | |||
| JP2011132588A | 2011-07-07 | |||
| JP2012188691A | 2012-10-04 |
Attorney, Agent or Firm:
Isamu Ogoshi
Ikki Kogoshi
Ikki Kogoshi
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