Title:
基板乾燥方法および基板処理装置
Document Type and Number:
Japanese Patent JP7010629
Kind Code:
B2
Abstract:
A substrate drying method for drying a front surface of a substrate having a pattern includes a sublimation-agent-liquid-film placing step of placing a liquid film of a liquid sublimation-agent on the front surface of the substrate, a high vapor-pressure liquid placing step of placing a liquid film of a high vapor-pressure liquid that has vapor pressure higher than the sublimation agent and that does not include water on the liquid film of the sublimation-agent placed on the front surface of the substrate, a vaporizing/cooling step of losing vaporization heat in response to vaporization of the high vapor-pressure liquid, and, cooling the sublimation-agent, and, as a result, solidifying the liquid film of the sublimation-agent, and, forming a sublimation-agent film on the front surface of the substrate, and a sublimating step of sublimating the sublimation-agent film.
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Inventors:
Manabu Okutani
Noriyuki Kikumoto
Naohiko Yoshihara
Hiroshi Abe
Noriyuki Kikumoto
Naohiko Yoshihara
Hiroshi Abe
Application Number:
JP2017167867A
Publication Date:
January 26, 2022
Filing Date:
August 31, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; F26B5/00
Domestic Patent References:
| JP2017037985A | ||||
| JP2015050414A | ||||
| JP2013033817A | ||||
| JP2013201302A | ||||
| JP2013042094A | ||||
| JP2012074564A | ||||
| JP2015142069A | ||||
| JP2016195207A |
Attorney, Agent or Firm:
Patent Business Corporation Ai Patent Office
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