Title:
基板処理方法および基板処理装置
Document Type and Number:
Japanese Patent JP7446181
Kind Code:
B2
Abstract:
The present invention improves the pattern collapse at a surface periphery of a substrate. A substrate processing method of the present invention has a first sublimation process of discharging a first gas toward the central portion of the surface of the substrate to flow the first gas through the entire solidified body to the periphery of the substrate to sublimate the entire solidified body, and a second sublimation process for discharging a second gas toward the periphery of the surface of the substrate to flow the second gas to the periphery of the substrate via the peripheral area on the periphery of the surface of a solidified body to sublimate the peripheral area. The initiation of the second sublimation process is earlier than the first sublimation process, and/or a flow rate of the second gas is greater than a flow rate of the first gas.
Inventors:
Masayuki Otsuji
Masahiko Kato
Yu Yamaguchi
Masahiko Kato
Yu Yamaguchi
Application Number:
JP2020139221A
Publication Date:
March 08, 2024
Filing Date:
August 20, 2020
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; F26B5/04
Domestic Patent References:
| JP2020004948A | ||||
| JP2020077826A | ||||
| JP2020035986A | ||||
| JP2015185713A | ||||
| JP2012243869A | ||||
| JP201856176A |
Foreign References:
| US20160133456 |
Attorney, Agent or Firm:
Shoichi Swing
Kazumasa Ohnishi
Kazumasa Ohnishi
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