Title:
基板処理方法、基板処理液及び基板処理装置
Document Type and Number:
Japanese Patent JP7030440
Kind Code:
B2
Abstract:
A substrate treating method, liquid and apparatus are provided which can reduce the amount of sublimable substance used for the drying of a substrate while reducing the collapse of pattern. The substrate treating method includes a step of supplying a liquid to the pattern-formed surface of the substrate, a step of solidifying the liquid on the pattern-formed surface to form a solidified body and a step of subliming the solidified body so as to remove it from the pattern-formed surface. The substrate treating liquid includes a molten sublimable substance and a solvent, the freezing point of the sublimable substance being higher than the freezing point of the solvent. When the sublimable substance and the solvent are separated, the sublimable substance is settled and in the solidification step, the settled sublimable substance is solidified to have a height equal to or higher than the height of a pattern.
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Inventors:
Yuta Sasaki
Application Number:
JP2017146883A
Publication Date:
March 07, 2022
Filing Date:
July 28, 2017
Export Citation:
Assignee:
Screen Holdings Co., Ltd.
International Classes:
H01L21/304; F26B5/06
Domestic Patent References:
| JP2013042094A | ||||
| JP2017005134A | ||||
| JP2015050414A | ||||
| JP2015037128A | ||||
| JP2013258272A | ||||
| JP5267307A |
Attorney, Agent or Firm:
Yasushi Koyama