Title:
SUBSTRATE TRANSFER SYSTEM
Document Type and Number:
Japanese Patent JP3143770
Kind Code:
B2
Abstract:
PURPOSE: To transfer a plurality of substrates to be processed while supporting on different supporting faces in one plane by eliminating the movable part and simplifying the structure.
CONSTITUTION: A plurality of supporting faces 2a, 2b being used for each moving path of a semiconductor wafer W between processing positions are formed on the same plane of tweezers 3 for delivering the semiconductor wafer W among a plurality of processing positions. Consequently, an unprocessed semiconductor wafer W can be transferred, while being supported on the supporting face 2a, to a processing section and a processed semiconductor wafer W can be transferred therefrom while being supported on the supporting face 2b.
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Inventors:
Kazunari Ueda
Masami Nakumoto
Hiroyuki Kudo
Masami Nakumoto
Hiroyuki Kudo
Application Number:
JP26805494A
Publication Date:
March 07, 2001
Filing Date:
October 07, 1994
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B65G49/07; B25J15/06; H01L21/677; H01L21/68; H01L21/687; (IPC1-7): H01L21/68; B25J15/06; B65G49/07
Domestic Patent References:
| JP521579A | ||||
| JP4180246A |
Attorney, Agent or Firm:
Kikuhiko Nakamoto