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Title:
SURFACE MOUNTING CONTACT
Document Type and Number:
Japanese Patent JP2012004025
Kind Code:
A
Abstract:

To provide a surface mounting contact capable of suppressing bound and/or difficulty of suction and attaching when letting a suction nozzle of an automatic mounting machine perform the suction and attaching, and to enhance reliability of electric connection between the surface mounting contact and its opponent conductive body in terms of its structure.

One end part of a conductive member 10 is formed as first electrodes 20 solder-mounted to a one-side conductive body formed as a solder land L of a base plate P. The other end part of the conductive member 10 is formed as second electrodes 30 resiliently contacting an another-side conductive body formed as a shield metal plate 60. A suction assist body 50 having an outer face 51 capable of being used as a suction face for performing suction and attaching of a suction nozzle of an automatic mounting machine thereto is formed in the midway of the conductive member 10. A bottom face 53 as part of the outer face 51 is formed as a seating surface which is seated on a plate face of the base plate P. The conductive member 10 is an assembly of a plurality of parallel pin members 11 which individually have the first and second electrodes 20 and 30.


Inventors:
TOMONO TOSHIHIRO
Application Number:
JP2010139412A
Publication Date:
January 05, 2012
Filing Date:
June 18, 2010
Export Citation:
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Assignee:
FUNAI ELECTRIC CO
International Classes:
H01R12/55; H01R12/51



 
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