To provide a surface roughening method and a surface roughening device for copper foil with which the consumption of an anode electrode is reduced even in roughening plating treatment at a high current density, and the roughening plating treatment can easily be performed at a high current density.
The surface roughening device for copper foil is provided with: a plating tank 3 storing a plating liquid 4; an anode electrode 2 having a circular recessed face at the inside of the plating tank 3; and a roll 5 for plating arranged so as to be opposed to the anode electrode 2 and dipping the copper foil 1 into the plating liquid 4. The current density applied to the copper foil 1 on plating is controlled to 50 to 200 A/dm2, and the current density applied to the anode electrode 2 is controlled to ≤0.8 times that applied to the copper foil 1.
SASAKI HAJIME
KODAIRA MUNEO
Next Patent: SURFACE ROUGHENING METHOD FOR COPPER FOIL