Title:
SYSTEM FOR PROCESSING PROCESS
Document Type and Number:
Japanese Patent JP2014163804
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a wafer processing process with a compact, low-cost yield management system having a simplified network.SOLUTION: A system includes: a server system 1001; an evaluation system 1002; an input/output system 1003; and a detection system 1004 that is connected with a processing process 1005. A processed sample is irradiated with light and a charged particle beam; obtained first and second detection data is received by the detection system 1004 via an interface; inspection conditions are fed back, and inspection is performed. The processing process 1005 performs only the inspection, and the input/output system 1003 and the evaluation system 1002 perform evaluation.
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Inventors:
JINGU TAKAHIRO
Application Number:
JP2013035277A
Publication Date:
September 08, 2014
Filing Date:
February 26, 2013
Export Citation:
Assignee:
HITACHI HIGH TECH CORP
International Classes:
G01N21/956; G01B11/02; G01B11/30; G01B15/00; H01L21/66
Attorney, Agent or Firm:
Manabu Inoue
Yuji Toda
Shigemi Iwasaki
Yuji Toda
Shigemi Iwasaki
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