Title:
テープ貼り機及びテープ外し方法
Document Type and Number:
Japanese Patent JP6879840
Kind Code:
B2
Abstract:
A tape attaching machine for attaching an adhesive tape to a frame and a wafer and cutting the adhesive tape along the frame is provided. The tape attaching machine includes a tape winding unit configured to wind a remaining part of the adhesive tape left after cutting the adhesive tape, the remaining part of the adhesive tape being not attached to the frame and the wafer. The tape winding unit includes a main shaft like a roller and a pair of jigs detachably mounted on the opposite ends of the main shaft. Each of the jigs is engageable with the main shaft so as to have a tape contact area around which the remaining part of the adhesive tape is adapted to be wound and a grip area formed axially outside the tape contact area and adapted to be gripped by an operator.
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Inventors:
Halong
Application Number:
JP2017126097A
Publication Date:
June 02, 2021
Filing Date:
June 28, 2017
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
H01L21/683; B65H35/07; B65H75/10; B65H75/18
Domestic Patent References:
| JP2006327784A | ||||
| JP2007008663A | ||||
| JP2016068482A | ||||
| JP9123555A | ||||
| JP2002037530A | ||||
| JP6083670U | ||||
| JP2005089035A | ||||
| JP6177243A | ||||
| JP2008195500A | ||||
| JP2012079787A | ||||
| JP2002060141A | ||||
| JP11171375A | ||||
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| JP10175779A |
Attorney, Agent or Firm:
Patent Business Corporation Tokyo Alpa Patent Office