To inhibit variations of thermal treatment temperatures on a substrate surface and equalize line widths of a wiring pattern in the substrate surface in heat treatment conducted while the substrate is horizontally transferred.

A thermal treatment apparatus includes: substrate transfer means 20 horizontally transferring a substrate G along a substrate transfer path 2; first heating means 4 disposed along the substrate transfer path 2 and used for heating the substrate G; second heating means 5 disposed at a subsequent stage of the first heating means along the transfer path and used for heating the substrate G; substrate temperature detecting means 46 for detecting a temperature of the substrate G heated by the first heating means 4; and a control part 40 controlling a substrate transfer speed in the substrate transfer path 2c corresponding to the second heating means 5 on the basis of the detection result of the substrate temperature detecting means 46.