Title:
THERMAL TRIPPING DEVICE, AND CIRCUIT BREAKER
Document Type and Number:
Japanese Patent JP2010282787
Kind Code:
A
Abstract:
To provide a thermal tripping device for preventing a change in the curving characteristics of a bimetal when assembled.
The thermal tripping device includes the bimetal 11 to be heated by an overcurrent, and a conductive extension member 10 to which a flexible conductor 7 is joined. The extension member 10 is joined to the bimetal 11 with mechanical joint. The extension member 10 has one end extending from the opening end of the bimetal 11 for pushing a trip bar 8 by curving of the bimetal 11.
Inventors:
KAWAMURA KOJI
KOMOTO SHIGEKI
KOMOTO SHIGEKI
Application Number:
JP2009134105A
Publication Date:
December 16, 2010
Filing Date:
June 03, 2009
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01H71/16; H01H73/22
Attorney, Agent or Firm:
Shogo Takahashi
Kanako Murakami
Nakatsuru Kazutaka
Kanako Murakami
Nakatsuru Kazutaka
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