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Title:
THERMOSETTING RESIN COMPOSITION, PREPREG USING IT, AND LAMINATE
Document Type and Number:
Japanese Patent JP2009197242
Kind Code:
A
Abstract:

To provide a composition and a prepreg and the like superior in every phase like dielectric properties in spite of use of a non-halogen flame retardant.

The thermosetting resin composition contains (1) a metal salt of a disubstituted phosphinic acid and (2) a specific copolymer such as a resin having a dielectric constant of 2.9 or less at 1 GHz frequency or above. The prepreg and a laminate using the above thermosetting resin composition are also provided.


Inventors:
TSUCHIKAWA SHINJI
ARATA MICHITOSHI
TOMIOKA KENICHI
KOBAYASHI KAZUHITO
Application Number:
JP2009111298A
Publication Date:
September 03, 2009
Filing Date:
April 30, 2009
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08L25/02; C08J5/24; C08K5/3477; C08K5/5313; C08L33/14; C08L35/06; C08L63/00; C08L71/12; C08L79/00; H05K1/03
Domestic Patent References:
JP2002317085A2002-10-31
JP2002161211A2002-06-04
JP2000219772A2000-08-08
JPS4974736A1974-07-18
JP2001525327A2001-12-11
JPH0387230A1991-04-12
Foreign References:
US4777227A1988-10-11
Attorney, Agent or Firm:
Hajime Tsukuni
Koshiro Tsukuda
Fusayuki Saito



 
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