Title:
THICK-FILM CAPACITOR, PRINTED SUBSTRATE WITH THICK-FILM CAPACITOR EMBEDDED INSIDE, METHOD FOR FORMING SUCH CAPACITOR, AND METHOD FOR FORMING PRINTED SUBSTRATE
Document Type and Number:
Japanese Patent JP2006196877
Kind Code:
A
Abstract:
To provide a thick-film capacitor resistant to an etching liquid.
A method for embedding a thick-film capacitor includes a process for etching a foil electrode at the outside of the boundary of a capacitor dielectric layer in order to prevent the etching liquid from coming into contact with the capacitor dielectric layer and prevent the capacitor dielectric layer from being damaged.
Inventors:
BORLAND WILLIAM J
Application Number:
JP2005349565A
Publication Date:
July 27, 2006
Filing Date:
December 02, 2005
Export Citation:
Assignee:
DU PONT
International Classes:
H01G4/33; H01G2/06; H01G4/12; H01L23/12; H05K3/46
Attorney, Agent or Firm:
Yoshikazu Tani
Kazuo Abe
Kazuo Abe