Title:
THIN-FILM CAPACITOR
Document Type and Number:
Japanese Patent JP3389435
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a lamination-type thin-film capacitor that can be packaged easily and has a large-capacity and low-impedance structure.
SOLUTION: A thin-film capacitor is composed of a substrate, a first electrode layer 2 formed on the substrate, a dielectric layer 3 formed on the first electrode layer 2, and a second electrode layer 4 formed on the dielectric layer 3. The capacitor has a pair of terminal electrodes 5 that are connected to one terminal of the first electrode layer 2 or the second electrode layer 4 at both terminal parts. In this case, slits 7 and 8 are formed at the first and second electrode layers 2 and 4, and at the same time the slit 7 of the first electrode layer 2 and the slit 8 of the second electrode layer 4 have a specific relative angle θ. In this case, the relative angle θ that is formed at the side of the terminal electrode 5 of the slit 7 of the first electrode 2 and the slit 8 of the second electrode layer 4 is preferably 60 degrees or larger.
Inventors:
Fumio Fukumaru
Atsushi Shigeo
Naoken Nagakara
Atsushi Shigeo
Naoken Nagakara
Application Number:
JP34821996A
Publication Date:
March 24, 2003
Filing Date:
December 26, 1996
Export Citation:
Assignee:
Kyocera Corporation
International Classes:
H01G2/00; H01G4/30; H01G4/33; (IPC1-7): H01G4/30; H01G4/33
Domestic Patent References:
| JP2156618A |