薄膜の膜応力評価方法と弾性率・線膨張率同定方法

Title:

薄膜の膜応力評価方法と弾性率・線膨張率同定方法

Document Type and Number:

Japanese Patent JP3994884

Kind Code:

B2

More Like This:

JP3222816	STRESS AND DISTORTION ANALYZING DEVICE AND METHOD THEREFOR, AND GROUND ANALYZING METHOD
JPS51139372	SENSOR LOGIC CIRCUIT SYSTEM FOR PRESSURE SENSOR

Inventors:

Manabu Kakino
Tsuneyuki Ejima
Kenichi Yamamoto
Daisuke Suetsugu
Zako Masaru
Kurashiki Tetsuo
Kubo Futoshi

Application Number:

JP2003037793A

Publication Date:

October 24, 2007

Filing Date:

February 17, 2003

Export Citation:

Assignee:

Matsushita Electric Industrial Co., Ltd

International Classes:

G01L1/00; G01N3/20; G01M5/00; G01N3/00; G01N25/16

Domestic Patent References:

Attorney, Agent or Firm:

Fumio Iwahashi
Hiroki Naito
Daisuke Nagano

Previous Patent: 電圧変換装置および電圧変換装置の故障判定をコンピュータに実行させる�...

Next Patent: ＭＥＭＳ素子とその製造方法、回折型ＭＥＭＳ素子