THIN SLICE PREPARATION DEVICE

Title:

THIN SLICE PREPARATION DEVICE

Document Type and Number:

Japanese Patent JP2010266394

Kind Code:

A

Abstract:

To provide a miniaturizable thin slice preparation device capable of suppressing a depth dimension of the device.

This thin slice preparation device 1 includes a cutting blade 6 for slicing an embedding block B for embedding a biosample, a moving mechanism 5 for slicing the upper surface of the embedding block B with the cutting blade 6 by moving the embedding block B toward the blade side of the cutting blade 6, and a conveyance mechanism 9 for conveying a thin slice X scraped out from the embedding block B. In the device 1, the blade of the cutting blade 6 is extended vertically to the front face 1a of the device, and the embedding block B is moved obliquely to the front face 1a of the device by the moving mechanism 5, and the thin slice X is conveyed along the front face 1a of the device by the conveyance mechanism 9.

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Inventors:

KIJIMA YUKIMITSU
ITO TETSUO
NONOYAMA MASATOSHI

Application Number:

JP2009119711A

Publication Date:

November 25, 2010

Filing Date:

May 18, 2009

Export Citation:

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Assignee:

SEIKO INSTR INC

International Classes:

G01N1/06

Attorney, Agent or Firm:

Masatake Shiga
Tadashi Takahashi

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