PHOTOSETTING RESIN COMPOSITION

Title:

PHOTOSETTING RESIN COMPOSITION

Document Type and Number:

Japanese Patent JPH0692974

Kind Code:

A

Abstract:

PURPOSE: To obtain a photosetting resin compound consisting of a specific organosilicone compound, excellent in compatibility, water repellency, heat resistance and surface hardness and useful for coating resins, etc., and its composition.

CONSTITUTION: The photosetting compound expressed by formula I to formula VI [R1 is (meth)acryl or cinnamoyl; R2 to R4 are H, methyl, phenyl, vinyl or 3,3,3-trifloropropyl; (m) is 1-50; (n) is 1-10000; l is 2-50]. Furthermore, 0.01-10% photopolymerization initiator is added to this compound to provide the photosetting composition.

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Inventors:

MATSUKAWA KOYO
HASEGAWA KIICHI
INOUE HIROSHI
FUKUDA AKINORI
ARITA YASUSHI

Application Number:

JP9756192A

Publication Date:

April 05, 1994

Filing Date:

April 17, 1992

Export Citation:

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Assignee:

SUMITOMO DUREZ CO
OSAKA CITY

International Classes:

C07F7/08; C08G77/38; C08L83/04; C08L83/06; G03F7/075; (IPC1-7): C07F7/08; C08G77/38; C08L83/06; G03F7/075

Next Patent: NEW SILANOL