PURPOSE: To perform an automatic assembly with high accuacy, by pulling up a chip after assembling the chip whereon an inner lead top end is punched and the inner lead top end into a state before punching and after press-fixing on an insulating substrate via a glass member.

CONSTITUTION: A glass member 12 is adhered over the entire surface except for a cavity part 13 on an insulating substrate 11. An IC lead frame 14 is retained by an outer frame 14, at the root, and the chip 18 separate when a press work is assembled to the inner lead top end 14" resulting in the fixation of the positioning accuracy for the top end. After press-fixing this lead frame 14 on the substrate via the glass member 12, the chip 18 is pulled up. A semiconductor element 15 and a metallic fine wire 16 are provided. Thus, the positioning accuracy for the inner lead top end is enhanced and an automatic assembly is facilitated.