Title:
LIGHT EMITTING DIODE
Document Type and Number:
Japanese Patent JPS5866374
Kind Code:
A
Abstract:
PURPOSE:To realize high luminance of light emitting diode (LED) by providing an electrode leading bonding pad to the end part of lead including the reflection wall deposited surrounding a diode pellet and by providing two or more LED's within one enclosure case. CONSTITUTION:At each end part of the lead frames 11b, 11c, a flat dent 15 is formed by the pressing etc. in order to realize reflection to upward opening, while at the bottom part of dent, the LED pellets 12a, 12b consisting of a compound semiconductor such as Ga, GaAlAs are mounted by a conductive epoxy. The resistance chip 13a and pellet 12a, end part of lead 11c and pellet 12b, end part of lead 11b and resistance chip 13b are wired and bonded by a fine lead consisting of Au etc.
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Inventors:
FUKUDA IKUO
Application Number:
JP16502681A
Publication Date:
April 20, 1983
Filing Date:
October 16, 1981
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L25/075; H01L33/30; H01L33/60; H01L33/62; (IPC1-7): H01L33/00
Domestic Patent References:
| JP56063067B | ||||
| JP54153877B | ||||
| JP53124654B | ||||
| JP54103172B |
Attorney, Agent or Firm:
Takehiko Suzue