Title:
ASSEMBLING METHOD FOR ELECTRONIC CIRCUIT DEVICE
Document Type and Number:
Japanese Patent JPS58166737
Kind Code:
A
Abstract:
PURPOSE:To enable to extract the block of carriers, which contain a plurality of ICs and become independent electrically, to measure characteristics under the state in which a plurality of ICs are made to be contained and to simplify treatment by cutting a ceramic package along a terminal row in the specific direction. CONSTITUTION:IC Chips are sealed through resin molding or capping 9, and a ceramic-carrier substrate is divided into longitudinal rectangular forms as shown in the figure by being broken along the through-holes of vertical (Y direction) wiring terminals from the arrow A in the figure. Accordingly, the ceramic- carrier substrate 1a divided in to longitudinal forms contains a plurality of ICs, but all of wiring for plating conduction are mutually separated electrically through the cutting of ceramics in the Y direction. The longitudinal ceramic- carriers are set to a socket for measuring characteristics by using a proper jig, characteristics are measured at each IC, and ICs to be selected are determined.
Inventors:
ENDOU TSUNEO
Application Number:
JP4914282A
Publication Date:
October 01, 1983
Filing Date:
March 29, 1982
Export Citation:
Assignee:
HITACHI LTD
International Classes:
H01L23/12; H01L21/52; H01L21/66; H01L23/498; (IPC1-7): H01L21/58; H01L21/66; H01L23/12
Attorney, Agent or Firm:
Toshiyuki Usuda