Title:
ULTRASONIC BONDING METHOD
Document Type and Number:
Japanese Patent JP2018094604
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic bonding method of dissimilar materials that restricts deviation between a material to be bonded and a tool, so that bonding strength is improved.SOLUTION: In an ultrasonic bonding method, a body to be bonded obtained by laminating plural materials to be bonded, is subjected to ultrasonic oscillation in a pressurized state so that the materials to be bonded are joined. In the ultrasonic bonding method, on a tool side where the ultrasonic oscillation is generated, materials to be bonded that are composed of a material with a relatively low yield strength among the plural materials to be bonded or with a 0.2% yield strength are placed to be subjected to the ultrasonic oscillation. At least one of the plural materials to be bonded is preferably stainless steel.SELECTED DRAWING: Figure 2
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Inventors:
NISHIJIMA SHINNOSUKE
TAKEDA NAOKI
TOMIMURA HIROKI
TAKEDA NAOKI
TOMIMURA HIROKI
Application Number:
JP2016242532A
Publication Date:
June 21, 2018
Filing Date:
December 14, 2016
Export Citation:
Assignee:
NISSHIN STEEL CO LTD
International Classes:
B23K20/10
Domestic Patent References:
| JP2011000611A | 2011-01-06 | |||
| JP2002336974A | 2002-11-26 | |||
| JP2013031869A | 2013-02-14 |
Attorney, Agent or Firm:
Hayashi Ichiyoshi
Akihiro Kitamura
Akihiro Kitamura