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Title:
ULTRASONIC CUTTING DEVICE
Document Type and Number:
Japanese Patent JP2017193000
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an ultrasonic cutting device of a film which improves cutting stability to suppress generation of resin powder and the like when cutting the film during conveyance, prevents a black foreign object from adhering to the film due to the resin powder and the like, and does not require product inspection through visual inspection of a manufactured pouch to enhance productivity of the film.SOLUTION: An ultrasonic cutting device 11 for cutting a conveyed long film welded body 21 with ultrasonic cutters 15 (15a, 15b, 15c) comprises a conveyance roller 16 for conveying and supporting the long film welded body 21 to be cut by the ultrasonic cutters 15 (15a, 15b, 15c), and a press roller 17 for applying tension to the long film welded body 21. In the conveyance roller 16, an annular groove 51 is formed in a circumferential direction at a position facing cutting blades 40 (40a, 40b, 40c) of the ultrasonic cutters 15 (15a, 15b, 15c). The cutting blades 40 (40a, 40b, 40c) are configured to cut the long film welded body 21 while vibrating toward the inside of the annular groove 51.SELECTED DRAWING: Figure 2

Inventors:
HORIHATA KENTO
MUNECHIKA YUICHI
NAKANISHI TAKAO
MARUYAMA AKIMASA
Application Number:
JP2016083500A
Publication Date:
October 26, 2017
Filing Date:
April 19, 2016
Export Citation:
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Assignee:
TOYO SEIKAN KAISHA LTD
International Classes:
B26D7/08; B26D3/00; B26D7/14
Domestic Patent References:
JP2002103271A2002-04-09
JP2005059189A2005-03-10
JP2005230968A2005-09-02
JPH0578497U1993-10-26
JPH06270095A1994-09-27
JP2004025438A2004-01-29
JPH0187896U1989-06-09
Attorney, Agent or Firm:
Masaki Higuchi