PURPOSE: To make it possible to move a wafer subjected to alignment control at high speed as it is in its initial positional attitude by a method wherein the title device is constituted into such a structure that the moving operation of the wafer can be conducted by a moving body having retention and release mechanisms for the wafer.

CONSTITUTION: The title device is provided with a moving body 102, which is situated in a structure, has retention and release mechanisms for a wafer 101 and conducts a transfer operation by a direct or indirect driving mechanism. The wafer 101 which is a material to be transferred subjected to alignment control to the device is carried in and is delivered on the moving body 102 having the detention and release mechanisms. The wafer 101 is held and fixed by the retention mechanism, the body 102 executes the transfer operation by the direct or indirect driving mechanism, which is annexed to the structure, to an arbitrary distance and after the moving body is stopped, the wafer is released and a delivery for carrying out the wafer is performed. Thereby, the wafer can be moved at high speed as it is in its initial positional attitude without being subjected to effect due to an inertia force.