To make the film thickness distribution uniform when the vapor deposition of a vapor deposition substance is performed onto a plurality of works to be deposited.

A holding member 10 for holding works to be deposited, to which the plurality of works W to be deposited are attached, is arranged at an upper part at the inside of a vacuum tank 1, and two evaporation sources 2A, 2B, in which a plurality of vapor deposition substances are filled, are arranged at a lower part of the tank 1. First correction plates 4A, 4B being fixed type are arranged between the holding member 10 and the evaporation sources 2A, 2B, and second correction plates 5A, 5B being movable type are arranged between the evaporation sources 2A, 2B and the First correction plates 4A, 4B. The rotary shafts being attached to the second correction plates 5A, 5B are each attached on the central line equally dividing the flat surface of each second correction plate 5A or 5B, and the correction plates 5A, 5B are each rotated around the rotary shaft and switched to an operation state or a non-operation state.