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Title:
VAPOR DEPOSITION APPARATUS
Document Type and Number:
Japanese Patent JP2006312764
Kind Code:
A
Abstract:

To form a thin film free from a defect with the use of a coaxial-type vacuum-arc vapor-deposition source.

This vapor deposition apparatus has a cathode 43 arranged outside an opening of a pipe-shaped anode 31 so that a huge droplet radially springing out from the cathode 43 can not collide with a wall surface of the anode 31 and can not produce a small droplet. The huge droplet having sprung out toward a holder 12 collides with a rotating blade member 22 and can not pass through a filtering device 20. Only microparticles pass through it and form the thin film free from the defect on the surface of an object 5 to be film-formed.


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Inventors:
AGAWA YOSHIAKI
HARA YASUHIRO
AMANO SHIGERU
Application Number:
JP2005135854A
Publication Date:
November 16, 2006
Filing Date:
May 09, 2005
Export Citation:
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Assignee:
ULVAC CORP
International Classes:
C23C14/24; H01L21/285; H01L43/08; H01L43/12
Domestic Patent References:
JPH1161388A1999-03-05
JP2006249558A2006-09-21
JPH071065U1995-01-10
JPH09157837A1997-06-17
JPH1030169A1998-02-03
JP2003049262A2003-02-21
Attorney, Agent or Firm:
Shigeo Ishijima
Hideki Abe



 
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